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Contract processing services×D-process - List of Manufacturers, Suppliers, Companies and Products

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C2W Contract Processing Service

C2W Contract Processing Service

Achieving high-precision and low-cost 3D packaging in HBM and FO-WLP with C2W processing services!

Our company, which specializes in W2W bonding, offers C2W processing services. We address issues such as alignment discrepancies in W2W and improve efficiency and power savings compared to conventional technologies, including wire bonding. We achieve high-precision and low-cost 3D packaging in HBM and FO-WLP. 【Features】 ■ C2W TB support through high-precision alignment ■ High-efficiency stacking through parallel C2W ■ Efficiency improvements through the expansion of C2W to W2W bonding *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Pre-joining CMP contract processing services [Comprehensive catalog available]

Pre-joining CMP contract processing services [Comprehensive catalog available]

Surface roughness precision Ra 0.1~0.3 nm! Achieving smooth mirror surfaces of polycrystalline materials with our proprietary CMP slurry and polishing pads!

This catalog is a comprehensive catalog of D-process, which conducts CMP and wafer direct bonding prototyping and mass production, along with the transfer of associated processes. It provides detailed information on contract processing for CMP, wafer bonding, seed layer formation, and plating, among others. [Contents (excerpt)] ■ Contract processing for CMP ■ Contract processing for wafer bonding ■ Contract processing for seed layer formation and plating ■ Other contract processing for processes ■ Back grinding (thinning) / Lapping / Diamond polishing ■ Edge treatment / Dicing *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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